Palm Pre teardown

Craft & Design
Palm Pre teardown
preTeardown.jpg

The iFixit fellas waited in line all night at the Sprint store to snag a new Palm Pre so they could reduce it down to its constituent parts. They’re geek like ‘at.

Then, PhoneWreck took over and did a thorough analysis of the Pre’s innards.

See their component diagram at the end of the teardown.

PhoneWreck’s observations:

There are some pretty interesting things that popped up on the Pre’s PCB’s. This is the first production device we’ve seen on the OMAP3 (Open Media Applications Processor) platform. OMAP3 is powered by the 600MHZ ARM Cortex A8, PowerVR SGX 530 (GPU), 430MHz C64x, DSP and ISP (Image Signal Processor) and was clearly designed to pack a punch – Dr. Wreck thinks we’re going to see this processor popping up in future netbook endeavours.

On the connections side we see the usual wifi/bluetooth combo going to Marvell and CSR with the W8686 and 63823 respectively. We also see the BaseBand win going to Qualcomm with the heavily integrated MSM6801A platform. The OMAP3 PMIC comes loaded with a USB tranceiver and Audio codec which even further reduces the overall board density of this device. We’re not fully sure – but it looks as if the Pre’s cool new multi-touch Touch Screen Controller win went to Cypress Semiconductor with the CP6944BA device.

PhoneWreck’s full analysis is online here.

Palm Pre Teardown

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Gareth Branwyn is a freelance writer and the former Editorial Director of Maker Media. He is the author or editor of over a dozen books on technology, DIY, and geek culture. He is currently a contributor to Boing Boing, Wink Books, and Wink Fun. His free weekly-ish maker tips newsletter can be found at garstipsandtools.com.

View more articles by Gareth Branwyn

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